General information

Type

CPU / Microprocessor

Market segment

Desktop

Family

Intel Core i3

Model number  ? 

i3-6100

CPU part numbers

• CM8066201927202 is an OEM/tray microprocessor

• BX80662I36100 is a boxed processor with fan and heatsink (English version)

• BXC80662I36100 is a boxed processor with fan and heatsink (Chinese version)

Frequency  ? 

3700 MHz

Bus speed  ? 

8 GT/s DMI

Clock multiplier  ? 

37

Package

1151-land Flip-Chip Land Grid Array

Socket

Socket 1151 / H4 / LGA1151

Size

1.48" x 1.48" / 3.75cm x 3.75cm

Introduction date

September 1, 2015 (announcement) September 1, 2015 (availability in Asia) September 27, 2015 (availability elsewhere)

Price at introduction

$117

S-spec numbers

Architecture / Microarchitecture

Microarchitecture

Skylake

Processor core  ? 

Skylake-S

Core stepping  ? 

S0 (QJZG, SR2HG)

Manufacturing process

0.014 micron

Data width

64 bit

The number of CPU cores

2

The number of threads

4

Floating Point Unit

Integrated

Level 1 cache size  ? 

2 x 32 KB 8-way set associative instruction caches 2 x 32 KB 8-way set associative data caches

Level 2 cache size  ? 

2 x 256 KB 4-way set associative caches

Level 3 cache size

3 MB 12-way set associative shared cache

Physical memory

64 GB

Multiprocessing

Uniprocessor

Extensions and Technologies

• MMX instructions

• SSE / Streaming SIMD Extensions

• SSE2 / Streaming SIMD Extensions 2

• SSE3 / Streaming SIMD Extensions 3

• SSSE3 / Supplemental Streaming SIMD Extensions 3

• SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4  ? 

• AES / Advanced Encryption Standard instructions

• AVX / Advanced Vector Extensions

• AVX2 / Advanced Vector Extensions 2.0

• BMI / BMI1 + BMI2 / Bit Manipulation instructions

• F16C / 16-bit Floating-Point conversion instructions

• FMA3 / 3-operand Fused Multiply-Add instructions

• EM64T / Extended Memory 64 technology / Intel 64  ? 

• NX / XD / Execute disable bit  ? 

• HT / Hyper-Threading technology  ? 

• VT-x / Virtualization technology  ? 

• VT-d / Virtualization for directed I/O

• MPX / Memory Protection Extensions

• SGX / Software Guard Extensions

• SMAP / Supervisor Mode Access Prevention

• SMEP / Secure Mode Execution Protection

Low power features

Enhanced SpeedStep technology  ? 

Integrated peripherals / components

Display controller

3 displays

Integrated graphics

GPU Type: HD 530 Graphics tier: GT2 Microarchitecture: Gen 9 Execution units: 24 Base frequency (MHz): 350 Maximum frequency (MHz): 1050

Memory controller

The number of controllers: 1 Memory channels: 2 Supported memory: DDR3L-1333, DDR3L-1600, DDR4-1866, DDR4-2133 Maximum memory bandwidth (GB/s): 34.1 ECC supported: Yes

Other peripherals

• Direct Media Interface 3.0

• PCI Express 3.0 interface (16 lanes)

Electrical / Thermal parameters

Maximum operating temperature  ? 

100°C

Thermal Design Power  ? 

51 Watt